Axial alignment of a lensed fiber in a grooved assembly

ABSTRACT

A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/136,229, filed on Apr. 22, 2016, entitled “Axial Alignment of aLensed Fiber in a Grooved Assembly,” which application is a divisionalof U.S. patent application Ser. No. 14/857,580, filed on Sep. 17, 2015,entitled “Axial Alignment of a Lensed Fiber in a Silica V-Groove,” nowU.S. Pat. No. 9,348,094, issued on May 24, 2016, which applicationclaims priority to U.S. Provisional Application No. 62/136,504, filed onMar. 21, 2015, and U.S. Provisional Application No. 62/136,503, filed onMar. 21, 2015, the disclosures of which are incorporated by referencefor all purposes.

BACKGROUND

Silicon integrated circuits have dominated the development ofelectronics, and many technologies based upon silicon processing havebeen developed over the years. Their continued refinement led tonano-scale feature sizes that can be important for making metal oxidesemiconductor CMOS (complementary metal-oxide semiconductor) circuits.Silicon can be used as an optical medium, particularly for light havinga wavelength of about 1.55 microns (m). Light having a wavelength of1.55 μm is often used for fiber-optic telecommunication systems.

Some silicon devices have both electronic and optical components.

BRIEF SUMMARY OF THE INVENTION

This application relates to coupling optical waveguides. Morespecifically, and without limitation, to coupling an optical fiber witha semiconductor waveguide, such as a waveguide made in silicon.

A v-groove assembly is used to edge couple a lensed fiber (e.g., anoptical fiber made of silica) with a waveguide in a photonic chip. Forexample the lensed fiber is butt-coupled to the photonic chip. Thev-groove assembly is made from fused silica (e.g., by diamond dicingand/or etching). Fused silica is used so that resin used in bonding thelensed fiber to the v-groove assembly, and/or bonding the v-grooveassembly to the photonic chip, can be cured, at least partially, bylight (e.g., ultraviolet (UV) light used to cure the resin). In someembodiments, the photonic chip comprises silicon, and the waveguidecomprises a crystalline-silicon core (e.g., the crystalline-silicon corebeing formed from a device layer of a silicon-on-insulator wafer). Insome embodiments, photonic chips comprising other materials are used(e.g., II-VI and/or III-V compounds; including GaAs and/or InP andrelated compounds). In some embodiments, the photonic chip comprises twosemiconductor materials. The photonic chip comprises an edge facet wherethe waveguide terminates and is coupled with the lensed fiber.

In some embodiments, a method for aligning an optical fiber with av-groove assembly is described. A facet of the v-groove assembly isplaced next to a mirror. A first end of the optical fiber is placed in av-groove of the v-groove assembly, wherein the v-groove assemblycomprises a base and a lid. The lid is placed over the optical fiber sothat the optical fiber is between the base and the lid. An adhesive isapplied to the v-groove assembly and/or the optical fiber for bondingthe optical fiber to the v-groove assembly. A second end of the opticalfiber is connected to a splitter, wherein the splitter is opticallycoupled with an optical source and a detector. Light of a firstwavelength is transmitted from the optical source, through the splitter,to the optical fiber, and out the optical fiber through a tip of thefirst end of the optical fiber. With the mirror, light of the firstwavelength is reflected back from the tip of the optical fiber back intothe optical fiber through the tip. Light of the first wavelength istransmitted from the tip to the detector through the splitter. Feedbackis received from the detector. A distance between the tip of the opticalfiber and the mirror is adjusted based on feedback from the detector.The adhesive is at least partially cured using light of a secondwavelength passing through the lid, after adjusting the distance betweenthe tip of the optical fiber and the mirror.

In some embodiments, the lid is made of fused silica; the base is madeof fused silica; light of the first wavelength is infrared light andlight of the second wavelength is ultraviolet light; adjusting thedistance between the tip of the optical fiber and the mirror includesmoving the optical fiber in an axial direction to optimize receivedpower at the detector; the chip comprises crystalline silicon and/orIII-V material; and/or the adhesive is an epoxy resin configured to beat least partially cured by ultraviolet light. In some embodiments, themethod further comprises bonding the v-groove assembly to a chip, afterat least partially curing the adhesive.

A system for aligning an optical fiber with a v-groove assembly isdescribed. The system comprises the optical fiber. The optical fiber hasa first end and a second end; and the first end comprises a tip. Thesystem comprises the v-groove assembly. The v-groove assembly comprisesa base; a lid, wherein the first end of the optical fiber is between thebase and the lid; and a facet for bonding to a chip, wherein the firstend of the optical fiber is placed between the base and the lid suchthat the facet extends beyond the of the optical fiber. The systemcomprises an optical source, detector, and splitter. The splitter iscoupled with the second end of the optical fiber, the optical source,and the detector. The system comprises a mirror for reflecting lightfrom the optical source traveling out of the tip of the optical fiberback into the tip of the optical fiber and to the detector.

In some embodiments, in the system for aligning an optical fiber with av-groove assembly, the optical source emits infrared light, the systemfurther comprises a lamp, the lamp emits ultraviolet light, and/or thesystem further comprises an adhesive, at least partially cured byultraviolet light, used to bond the optical fiber to the base and thelid; the v-groove assembly further comprises a v-groove, the opticalfiber is in the v-groove, and the v-groove does not extend to the facet;the system further comprises an optical circulator or an opticalisolator between the optical source and the splitter; the detector is apower meter; the lid is made of fused silica; and/or the base is made offused silica.

An optical assembly for connecting an optical fiber to a semiconductorwaveguide is described. The optical assembly comprises a v-grooveassembly and adhesive. The v-groove assembly comprises a base; a lid; av-groove; and a facet, wherein the facet is for bonding the v-grooveassembly to a chip. The optical fiber in the v-groove, positionedbetween the base and the lid. The adhesive bonds the optical fiber tothe base and the lid, wherein the adhesive is, at least partially, curedusing light. In some embodiments, the base and/or the lid comprise fusedsilica. In some embodiments, the lid consists of fused silica.

Further areas of applicability of the present disclosure will becomeapparent from the detailed description provided hereinafter. It shouldbe understood that the detailed description and specific examples, whileindicating various embodiments, are intended for purposes ofillustration only and are not intended to necessarily limit the scope ofthe disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts a perspective view of an embodiment an optical adapterusing a v-groove assembly.

FIG. 2 depicts a perspective view of an embodiment of a portion of thev-groove assembly.

FIG. 3 depicts a top view of an embodiment of the v-groove assemblyaligned with a chip.

FIG. 4 depicts an embodiment of an alignment station.

FIG. 5 depicts a flowchart of an embodiment of a process for aligning anoptical fiber in the v-groove assembly with a waveguide in a chip.

FIG. 6 depicts a simplified schematic top view of an embodiment of analignment system.

FIG. 7 depicts a simplified front view of an embodiment of a v-grooveassembly during working-distance alignment.

FIG. 8 depicts a simplified front view of another embodiment of av-groove assembly.

FIG. 9 depicts a simplified view of a further embodiment of a v-grooveassembly.

FIG. 10 depicts a flowchart of an embodiment of a process for aligningan optical fiber in the v-groove assembly.

FIG. 11 depicts a flowchart of an embodiment of a process for connectingan optical fiber, which is bonded to a v-groove assembly, with aphotonic chip.

In the appended figures, similar components and/or features may have thesame reference label. Further, various components of the same type maybe distinguished by following the reference label by a dash and a secondlabel that distinguishes among the similar components. If only the firstreference label is used in the specification, the description isapplicable to any one of the similar components having the same firstreference label irrespective of the second reference label.

DETAILED DESCRIPTION

The ensuing description provides preferred exemplary embodiment(s), andis not intended to limit the scope, applicability, or configuration ofthe disclosure. Rather, the ensuing description of the preferredexemplary embodiment(s) will provide those skilled in the art with anenabling description for implementing a preferred exemplary embodiment.It is understood that various changes may be made in the function andarrangement of elements without departing from the spirit and scope asset forth in the appended claims.

In some embodiments, an optical fiber is optically coupled to awaveguide in a chip (in some embodiments the chip is also referred to asa photonic chip or optical chip) using a v-groove assembly. For example,the waveguide is crystalline silicon etched in a device layer of asilicon-on-insulator substrate. The v-groove assembly is made of silica.For example, the v-groove assembly is made by dicing, machining,grinding, etching, and/or polishing fused silica. Silica (SiO2) is usedbecause silica is optically transparent to ultraviolet (UV) light insome forms. The optical fiber is bonded to the v-groove assembly using aresin cured by UV light, and/or the v-groove assembly is bonded to thechip using a resin cured by UV light. Forming the v-groove assembly fromsilica allows UV light to pass through parts of v-groove assembly forcuring the resin.

Referring to FIG. 1, a perspective view of an embodiment an opticaladapter 100 is shown. The optical adapter 100 optically couples awaveguide on a chip to a fiber-optics network. The optical adapter 100comprises an optical fiber 104, a v-groove assembly 108, and areceptacle 112. A first end 114 of the optical fiber 104 is attached tothe v-groove assembly 108, and a second end 115 of the optical fiber 104is attached to the receptacle 112.

In some embodiments, the optical fiber 104 is made of silica (e.g.,Corning SMF-28 Ultra or similar fibers). The optical fiber 104 comprisesa tip 116 at the first end 114 of the optical fiber 104. In someembodiments, the tip 116 is lensed (e.g., a tapered tip) for focusinglight exiting the tip 116 of the optical fiber 104. In some embodiments,the optical fiber 104 has an ultra-high numerical aperture (NA). Forexample, ultra-high NA fibers have NA≥0.25. In some embodiments,0.5≥NA≥0.25.

The first end 114 of the optical fiber 104 is secured to the v-grooveassembly 108. A lid 120 of the v-groove assembly 108 covers the opticalfiber 104 to secure the optical fiber 104 in the v-groove assembly 108.An adhesive that is cured by UV light (e.g., an epoxy resin, and/orUV/thermal curable, low-shrinkage epoxy resin) is used to secure theoptical fiber 104 to the v-groove assembly 108.

In some embodiments, the second end 115 of the optical fiber 104 isconnected to the receptacle 112. In some embodiments, the second end 115of the optical fiber is fusion spliced to a fiber network. In someembodiments, the receptacle 112 is shaped as an LC connector (e.g.,complying with IEC (International Electrotechnical Commission) standard61754-20). The receptacle 112 allows for more simple and/or convenientoptical connection to an optical network (e.g., for connecting to anintranet or to the Internet) than splicing optical fibers.

FIG. 2 depicts a perspective view of an embodiment of a portion of thev-groove assembly 108. The v-groove assembly 108 comprises the lid 120,and a base 202. The base 202 comprises a v-groove 204 and one or morefacets 208. In FIG. 2, the base 202 comprises a first facet 208-1 and asecond facet 208-2. The first facet 208-1 is to one side of the v-groove204 and the second facet 208-2 is to another side of the v-groove 204.The facets 208 are for bonding the v-groove assembly 108 to a chip.

The first end 114 of the optical fiber 104 is placed in the v-groove204, and the lid 120 is placed over the optical fiber 104. The facets208 extend beyond, in an axial direction, the v-groove 204 for bondingto a chip. The axial direction is a direction along an axis of theoptical fiber 104 (e.g., direction of beam propagation). A lateraldirection is orthogonal to the axial direction; and the lateraldirection can be further subdivided into a vertical direction and ahorizontal direction. The tip 116 of the optical fiber 104 extends pastthe v-groove 204, axially. In some embodiments, the facets 208 extendpast the v-groove 204 so that an adhesive used to bond the v-grooveassembly 108 to the chip is not as likely to cover the tip 116 of theoptical fiber 104. In some embodiments, the v-groove 204 comprises twobonding facets 208 to provide structural support when securing thev-groove assembly 108 to the photonic chip. The bonding facets 208extend past the v-groove 204 a first length 212. In some embodiments,the first length 212 is between 100 and 300 μm and/or 225 and 275 μm(e.g., 150, 200, 250, or 300 μm).

FIG. 3 depicts a top view of an embodiment of the v-groove assembly 108aligned with a chip 308. The chip 308 comprises a waveguide 312 (e.g., asemiconductor waveguide made of crystalline silicon). An adhesive 316 isused to bond the v-groove assembly 108 to the chip 308. The adhesive 316is applied to the bonding facet 208 of the v-groove assembly 108 and toan edge facet 320 of the chip 308.

In some embodiments, the chip 308 comprises and/or is optically coupledwith a receiver (e.g., photodiode). In some embodiments, the waveguide312 is optically coupled with the receiver. In some embodiments, thechip 308 comprises one or more other chips (e.g., III-V chips for a gainmedium) as described in U.S. application Ser. No. 14/509,914, filed onOct. 8, 2014, which is incorporated by reference. The v-groove assembly108 is aligned by applying adhesive 316 to the bonding facet 208 (or tothe edge facet 320 of the chip 308, or both), and the v-groove assembly108 is roughly aligned with the chip 308 (e.g., bringing the v-grooveassembly 108 near the edge facet 320 of the chip 308). Light istransmitted through the optical fiber 104 and into the waveguide 312. Agripper holding the v-groove assembly 108 is adjusted to position thetip 116 of the optical fiber 104 in relation to the waveguide 312 tooptimize optical transmission from the optical fiber 104 into thewaveguide 312 (e.g., the receiver registers a maximum power; apercentage of maximum power, e.g., >90%, 95%; or a predeterminedthreshold power). In some embodiments, the v-groove assembly 108 isactively aligned (e.g., using a computerized system). In someembodiments, a thickness of the adhesive 316 before a first cure isequal to or less than 10, 8, or 7 μm. In some embodiments, the bondingfacets 208 are polished and the thickness of the epoxy resin before thefirst cure is equal to or less than 5 μm (e.g., separation of thebonding facet from the edge facet is equal to or less than 5 μm). Insome embodiments, the bonding facets 208 are pitted and/or roughened foran adhesive 316 to better adhere to. In some embodiments, a thickness ofthe adhesive 316 before the first cure is 7-10 μm, because results frombonding show 7-10 μm forms a stable bond, which is sufficient for someapplications. In some embodiments, the waveguide 312 has a height(vertical) and/or width (horizontal) equal to or less than 12, 10, 8, 5,2, 1.7, 1.6, or 1.5 μm. In some embodiments, the waveguide has a height(vertical) and/or width (horizontal) greater than 1.0 or 1.5 μm forimproved coupling with the optical fiber 104 (e.g., with a taperingwaveguide). In some embodiments, only one dimension (e.g., a lateraldimension) is adjusted by the gripper holding the v-groove assembly 108.For example, a vertical height (i.e., into and out of the page of FIG.3) is determined by a height of the v-groove 204 of the v-grooveassembly 108; an axial distance (along a direction of beam propagationof the optical fiber 104) between the tip 116 of the optical fiber 104and the edge facet 320 of the chip 308 is determined by a distancebetween the tip 116 of the optical fiber 104 and the bonding facet 208.In some embodiments, the bonding facet 208 is placed to touch the edgefacet 320 of the chip 308, and then the v-groove assembly is moved awayfrom the edge facet 320 of the chip 308 a predetermined distance (e.g.,7-10 μm) before adhesive 316 is applied between the bonding facet 208and the edge facet 320.

After the tip 116 of the optical fiber 104 is aligned to the waveguide312 of the chip 308 (e.g., by the gripper holding the v-groove assembly108), a first cure of the adhesive 316 is performed (e.g., byirradiating the adhesive 316 with light). In some embodiments, theadhesive 316 is an epoxy resin cured with ultraviolet (UV) light (e.g.,light having a wavelength between 100 nm and 400 nm, or between 250 and400 nm). In some embodiments, the v-groove assembly 108 is made of fusedsilica, which is made transparent to UV light, so that UV light can beshined through the v-groove assembly 108 to cure the adhesive 316 thatis between the bonding facet 208 of the v-groove assembly 108 and theedge facet 320 of the chip 308. In some embodiments, the v-grooveassembly 108 is made of silica having greater than 60% or 70%transmission for wavelengths from 250 nm to 400 nm, or from 300 nm to400 nm (e.g., UV-grade silica and/or broadband silica). It is noted thatcrystalline silicon has low transmission (e.g., <20%) for wavelengthsless than 900 nm. In some embodiments, additional epoxy resin is addedafter the first cure (e.g., to sides and/or other surfaces of thev-groove assembly 108), and a second cure is performed where theadditional epoxy resin is cured with UV light. In some embodiments, twosteps of curing epoxy resin is used because the first cure is used toset alignment of the v-groove, wherein using less epoxy resin has lessshrinkage during UV cure. And the second cure, with the additional epoxyresin, is used to add more epoxy resin to form a more robust bondbetween the v-groove assembly 108 and the chip 308. After the secondcure (or in some embodiments after the first cure if the second cure isnot used), a thermal cure is performed. The thermal cure further hardensthe epoxy resin.

In some embodiments, coupling arrangement between the optical fiber 104and the waveguide 312 shown in FIG. 3 is compact, which reduces space ona printed circuit board assembly (PCBA). Further, coupling loss duringadhesive 316 cure is reduced and reliability is improved.

FIG. 4 depicts an embodiment of an alignment station 400. The alignmentstation 400 comprises a gripper 404 and a PCBA mount 408. The PCBA mount408 secures a PCBA 412. The PCBA 412 comprises a first chip 308-1 and asecond chip 308-2. The gripper 404 is used to align the v-grooveassembly 108 with the first chip 308-1 or the second chip 308-2. In someembodiments, mechanical controls 416 are used to move the gripper 404.In some embodiments, electrical connections 420 are used to automatealignment of the v-groove assembly 108 with the chip 308. Such a systemhas demonstrated robust, high coupling efficiency alignment. In someembodiments, a sub mount is used instead of the PCBA 412.

FIG. 5 depicts a flowchart of an embodiment of a process 500 foraligning the optical fiber 104, which is in the v-groove assembly 108,with the chip 308. The process 500 for aligning the optical fiber 104with the chip 308 begins in step 504 with loading the PCBA 412 (or a submount) on the PCBA mount 408. In some embodiments, the PCBA 412 isloaded on the PCBA mount 408 after chip(s) 308 and/or wire bonding areadded to the PCBA 412. The gripper 404 picks up the v-groove assembly108 (e.g., by the lid 120 of the v-groove assembly 108) and activelyaligns the v-groove assembly 108 with the chip 308, step 508. In someembodiments, alignment involves providing active lateral and/or activeaxial (longitudinal) alignment. For reliability, and/or to minimizemovement during adhesive 316 curing, in some embodiments, thickness ofthe adhesive 316 for butt-bonding between the v-groove assembly 108 andthe chip 308 is reduced (e.g., <10 μm). In some embodiments, aninitial-alignment position is established. After an initial alignment,the v-groove assembly 108 is moved, using the gripper 404, away from thechip 308. In step 512, adhesive 316 is applied to the v-groove assembly108 (e.g., bonding facets 208). In some embodiments, a first amount ofepoxy resin (e.g., a portion of adhesive 316) is applied to the bondingfacet(s) 208 of the v-groove assembly 108. The v-groove assembly 108 ismoved back to the initial-alignment position using the gripper 404(e.g., automatically using the gripper 404 and electrical connections420 after the first amount of epoxy resin is applied). In someembodiments, a final alignment is performed. In some embodiments, afirst cure of the adhesive 316 is performed, wherein the first cure atleast partially cures the first amount of epoxy resin between thebonding facet 208 and the edge facet 320 of the chip 308 (e.g., UVcuring by shining UV light through the v-groove assembly 108, such asthrough the bonding facet 208). In some embodiments, a second amount ofepoxy resin (e.g., a portion of adhesive 316) is applied to the v-grooveassembly 108 and/or the chip 308. In some embodiments, a second cure ofthe adhesive 316 is performed to further secure the v-groove assembly108 to the chip 308 and/or the PCBA 412 (e.g., the adhesive is atwo-step adhesive, which is thermally cured after UV curing). In someembodiments, the adhesive 316 is thermally cured after UV curing. Insome embodiments, additional assembly of the PCBA 412 is performed aftera UV curing and/or a thermal curing of the adhesive 316.

In some embodiments, using a v-groove assembly 108 bonded to the chip308 holds the optical fiber 104 with high stability for opticalcoupling; the fused silica optical properties enable UV curing of theadhesive 316 (e.g., epoxy resin) between the v-groove assembly 108 andthe chip 308. Shifting of the tip 116 of the optical fiber 104 during UVcuring and/or thermal curing is small (e.g., is less than 0.5, 0.4, 0.3,0.2, or 0.1 μm, in each of the three directions); and/or directlybonding the v-groove assembly 108 to the edge facet 320 of the chip 308makes a stable bond when temperature varies. In some embodiments, asimilar design can be applied to discrete optics coupling. For example,an optical assembly is formed that holds a discrete optical element(e.g., a lens). The optical assembly has facets for bonding to aphotonic chip similar to the bonding facets 208 of the v-groove assembly108. The optical assembly is then bonded to the photonic chip (e.g.,similarly as the v-groove assembly 108 is bonded to the chip 308).Because of a larger working distance that discrete optical elementsnormally have, a geometry with discrete optics would not likely be ascompact as for a lensed fiber. However, attachment of an optical mountdirectly to the edge facet 320 of the chip 308 would still provide amore compact geometry and a direct attachment of the discrete opticalelement to the chip 308, minimizing movement during curing and fromthermal effects, and/or improving reliability.

In a previous approach by the applicant (and not admitted by theapplicant to be prior art), a discrete lens plus a fiber collimator wasused. Fiber output was collimated using a pigtailed collimator. Adiscrete lens coupled light into a waveguide (e.g., waveguide 312 on thechip 308). Some embodiments of this disclosure differ in that a lensedfiber is directly coupled to the waveguide (e.g., without a collimatorand/or discrete lens); a v-groove assembly 108 is used to hold theoptical fiber 104; the v-groove assembly 108 is attached directly to thechip 308 (e.g., by epoxy); higher optimal coupling efficiency duringalignment is achieved; less movement during epoxy resin curing isachieved; improved final coupling efficiency is achieved; higherreliability is achieved; reduced temperature dependence of couplingefficiency due to thermal expansion due to compact geometry and/orlimited epoxy thickness is achieved; and/or reduced board real estate isachieved.

Referring next to FIG. 6, a simplified schematic top view of anembodiment of an alignment system 600 is shown. The alignment system 600is used to align and bond the optical fiber 104 to the v-groove assembly108. The alignment system 600 comprises the optical fiber 104, the base202 of the v-groove assembly 108, an optical source 604, an opticalisolator 606, a splitter 608, a mirror 612, a detector 616, and a lamp620.

The optical source 604 is a laser, LED, or RCLED (resonant-cavity LED)emitting light of a first wavelength (e.g., light centered at a firstwavelength). In some embodiments, the first wavelength is between 1000nm and 1800 nm or between 1300 nm and 1600 nm (e.g., having a peakintensity at 1550 nm). The optical isolator 606 passes light travelingfrom the optical source 604, and attenuates and/or blocks light frombeing transmitted to the optical source 604. The optical source 604 isoptically coupled with the splitter 608, with the optical isolator 606being between the optical source 604 and the splitter 608. The splitter608 is optically coupled with the second end 115 of the optical fiber104. For example, the splitter 608 is optically coupled with thereceptacle 112 of the optical adapter 100.

The base 202 of the v-groove assembly 108 shown in FIG. 6 is similar tothe base 202 of the v-groove assembly 108 show in FIG. 3. The lid 120 ofthe v-groove assembly 108 is not shown in FIG. 6. The bonding facet 208of the base 202 of the v-groove assembly 108 is placed next to themirror 612. In some embodiments, the bonding facet 208 touches themirror. In some embodiments, the bonding facet 208 is placed close tothe mirror 612, but not touching the mirror (e.g., less than 1, 2, 5, 7,or 10 μm away from the mirror).

The optical fiber 104 is placed in the v-groove 204 of the base 202 ofthe v-groove assembly 108. The tip 116 of the optical fiber 104 isdirected towards the mirror 612. Adhesive is applied to the opticalfiber 104 and/or the base 202 of the v-groove assembly 108 (e.g., to thev-groove 204, to an interface between the base 202 and the lid 120,and/or placing the lid 120 over the base 202, at least partiallycovering the optical fiber 103, and adhesive is applied between theoptical fiber 104 and the lid 120, such that capillary action brings theadhesive into interfaces between the lid 120, the optical fiber 104,and/or the base 202). In some embodiments, adhesive is applied to thelid 120 of the v-groove assembly 108. In some embodiments, the adhesiveapplied to the optical fiber 104 and/or the base 202 of the v-grooveassembly 108 is similar to the adhesive 316 applied between the bondingfacet 208 and the edge facet 320 in FIG. 3. The bonding facet 208 helpsorient the direction of beam propagation from the optical fiber 104 tobe orthogonal a surface of the mirror 612, because the bonding facet 208is orthogonal to a length of the v-groove 204. The lid 120 is placedover the v-groove 204, at least partially covering the optical fiber104. The adhesive applied to the optical fiber and/or the base 202 ofthe v-groove assembly 108 is not cured until after aliment of theoptical fiber 104 in the v-groove assembly 108. The bonding facet 208 isnot bonded to the mirror 612.

The splitter 608 is optically coupled with the detector 616. In someembodiments, the detector 616 is a power meter. Light of the firstwavelength is transmitted from the optical source 604, through thesplitter 608 and into the optical fiber 104. Light of the firstwavelength is then transmitted out the tip 116 of the optical fiber 104,to the mirror 612, and reflected back into the tip 116 of the opticalfiber 104. Light of the first wavelength then travels from the tip 116to the splitter 608 and to the detector 616.

A distance, which is referred to as a working distance 624, separatesthe tip 116 of the optical fiber 104 from the mirror 612. The opticalfiber 104 is moved longitudinally (in an axial direction), within thev-groove 204, to adjust the working distance 624. The tip 116 of theoptical fiber 104 is lensed. As the working distance 624 approaches afocal length of the lens of the tip 116, optical power at the detector616 increases because more optical power is being reflected back intothe optical fiber 104. The working distance 624 is optimized (e.g., tohave power above a predetermined threshold, or a percentage of maximum).In some embodiments, after the working distance 624 is optimized, theoptical fiber 104 is then advanced so that the tip 116 goes toward themirror 612 (i.e., reducing the working distance 624) a predetermineddistance corresponding to an expected thickness of adhesive 316 betweenthe bonding facet 208 and the edge facet 320 (e.g., 1-10 μm).

After the working distance 624 is set, adhesive applied to the lid 120,the optical fiber 104, and/or the base 202 of the v-groove assembly 108is at least partially cured using a light source of a second wavelength.In the alignment system 600, the lamp 620 is used as the light source ofthe second wavelength. The lid 120 is made of fused silica because fusedsilica transmits UV light. The lamp 620 emits UV light that istransmitted through the lid 120 to at least partially cure the adhesiveapplied to the optical fiber 104 and/or the base 202 of the v-grooveassembly 108.

In some embodiments, an epoxy resin is placed on the v-groove assembly108 and/or the optical fiber 104 before alignment so that the fiber 104can be fixed in position after optimization. In some embodiments, thelid 120 serves to retain and protect the optical fiber 104 and/or serveas a handle for gripper 404 to hold the v-groove assembly 108 forlateral and/or axial alignment with the chip 308. In some embodiments,adhesive applied to the v-groove assembly 108 and/or the optical fiber104 is also thermally cured. In some embodiments, the adhesive appliedto the v-groove assembly and/or the optical fiber 104 has a first,initial cure followed by additional adhesive and a second cure. In someembodiments, the second cure is followed by a heat cure.

In some embodiments, once a set working distance 624 is known, thensubsequent fibers can be positioned in v-groove assemblies 108 using amicroscope and eyepiece (reticle scale). In some embodiments, in placeof the splitter 608 and the isolator 606, an optical circulator may beused. In some embodiments, the lid 120, the v-groove 204, and/or thebonding facets 208 are made of fused silica. In some embodiments, thelid 120 is fused silica for curing epoxy resin that secures the lid 120to other portions of the v-groove assembly 108 and/or to the opticalfiber 104.

FIG. 7 depicts a simplified front view of an embodiment of a v-grooveassembly 108 during working-distance alignment. The v-groove assemblycomprises the v-groove 204, a first bonding facet 208-1, a secondbonding facet 208-2, and the lid 120. The tip 116 of the optical fiber104 is shown between the lid 120 and the v-groove 204. Adhesive 704between the lid 120 and the v-groove 204 bonds the optical fiber 104 tothe v-groove assembly 108. In some embodiments, the adhesive 704 is usedto bond the lid 120 to the base 202 of the v-groove assembly 108. Insome embodiments, additional adhesive is used to bond the lid 120 to thebase 202 of the v-groove assembly 108 (e.g., sides of the lid 120).

Referring next to FIGS. 8 and 9, FIGS. 8 and 9 depict additionalembodiments of the v-groove assembly 108. FIG. 8 depicts a simplifiedfront view of an embodiment of a v-groove assembly 108. FIG. 8 issimilar to FIG. 7, except instead of having the first bonding facet208-1 and the second bonding facet 208-2, the v-groove assembly 108 inFIG. 8 has only one bonding facet 208.

FIG. 9 depicts a simplified view of an embodiment of a v-groove assembly900. The v-groove assembly 900 comprises a base 902 and a lid 920. Thelid 920 comprises a v-groove 904. The base 902 comprises a bonding facet908. An optical fiber 104 is placed between the base 902 and the lid920. The base 902 further comprises a recess formed by a floor 912 andwalls 916. The recess helps prevent adhesive from getting on the tip 116of the optical fiber 104.

FIG. 10 depicts a flowchart of an embodiment of a process 1000 foraligning an optical fiber 104 in the v-groove assembly (e.g., v-grooveassembly 108 or 900). The process 1000 for aligning an optical fiber 104in the v-groove assembly 108 begins in step 1004 by placing a facet(e.g., bonding facet 208) of the v-groove assembly next to a mirror(e.g., mirror 612). In some embodiments, placing the bonding facet 208next to the mirror 612 means the bonding facet 208 contacts the mirror612. In some embodiments, placing the bonding facet 208 next to themirror 612 means the bonding facet 208 is close to, but not contacting,the mirror 612 (e.g., less than 15, 10, or 5 μm from the mirror 612). Insome embodiments, the bonding facet 208 does not contact the mirror 612in order to compensate for an estimated thickness of adhesive 316 forbonding the v-groove assembly 108 to the chip 308.

In step 1008, the first end 114 of the optical fiber 104 is placed inthe v-groove 204 of the v-groove assembly 108. The lid 120 is placed onthe base 202 of the v-groove assembly 108, covering at least a portionof the first end 114 of the optical fiber 104. The optical fiber 104 isbetween the base 202 of the v-groove assembly 108 and the lid 120 of thev-groove assembly 108. Then adhesive 704 (e.g. an epoxy resin) isapplied between the optical fiber 104 and the lid 120. Capillary actiondraws the adhesive into an interface between the lid 120, the opticalfiber 104, and/or the base 202. In step 1012, the second end 115 of theoptical fiber 104 is connected to the splitter 608.

In step 1016, light of a first wavelength is transmitted from theoptical source 604, through the splitter 608, and to the first end 114of the optical fiber 104. In some embodiments, light of the firstwavelength is transmitted through an optical isolator 606 positionedbetween the source 604 and the splitter 608. In some embodiments, thelight of the first wavelength is infrared (e.g., between 1250 nm and1600 nm). Light of the first wavelength is transmitted out of the firstend 114 of the optical fiber 104 through the tip 116 of the opticalfiber 104.

In step 1020, light of the first wavelength transmitted out of the firstend 114 of the optical fiber 104 through the tip 116 of the opticalfiber 104 reflects off the mirror 612 and back into the first end 114 ofthe optical fiber 104 through the tip 116 of the optical fiber 104.Reflected light of the first wavelength from the mirror 612 travels fromfirst end 114 of the optical fiber 104, to the second end 115 of theoptical fiber 104, to the splitter 608, and from the splitter 608 to thedetector 616. The isolator 606 is used to keep light from reflectingback into the source 604.

In step 1024, a distance (e.g., the working distance 624) is adjustedbetween the tip 116 of the optical fiber 104 and the mirror 612 based onfeedback from the detector 616. For example, the detector 616, in someembodiments, is a power meter. The tip 116 of the optical fiber 104 ismoved axially (e.g., toward or away from the mirror 612) and a powerreading of the detector 616 changes. Power increases as the workingdistance 624 approaches a focal length of the tip 116 (e.g., a lensedfiber). Power decreases as the working distance 624 departs from thefocal length of the tip 116 of the optical fiber 104.

Once the working distance 624 is adjusted based on feedback from thedetector 616, adhesive 704 in the v-groove 204 is cured using lamp 620.To cure the adhesive 704 in the v-groove, light of a second wavelength(e.g., UV light), is transmitted through the lid 120 to cure theadhesive 704 in the v-groove 204, step 1028. Since the lid 120 is madeof fused silica, UV light can penetrate through the lid 120 to cure theadhesive 704 in the v-groove 204. Thus the optical fiber 104 can bealigned with, and bonded to, in the v-groove assembly 108 accuratelyand/or with less risk of altering alignment of the optical fiber 104during curing than previous bonding techniques (e.g., alignment can bedone before curing).

In some embodiments, the bonding facet 208 contacts the mirror 612 andadjusting the working distance 624 includes moving the tip 116 of theoptical fiber 104 toward the mirror 612 to compensate for an estimatedthickness of adhesive 316 for bonding the v-groove assembly 108 to thechip 308.

FIG. 11 depicts a flowchart of an embodiment of a process 1100 forbonding a v-groove assembly 108, which is bonded to an optical fiber104, to a chip 308. In some embodiments, the chip 308 comprises silicon(e.g., a silicon-on-insulator (SOI) wafer having a waveguide in a devicelayer of the SOI wafer). The process 1100 for bonding the v-grooveassembly 108 to the chip 308 begins in step 1104 where a v-grooveassembly 108 is provided. For example, the optical adapter 100,comprising the receptacle 112, optical fiber 104, and v-groove assembly108, is provided.

An adhesive (e.g., adhesive 316, such as an epoxy resin) is applied to afacet (e.g., bonding facet 208) of the v-groove assembly 108, step 1108.In some embodiments, adhesive 316 is applied to the edge facet 320 inaddition to, or in lieu of, applying adhesive 316 to the v-grooveassembly 108. In some embodiments, applying adhesive 316 to the v-grooveassembly comprises applying adhesive 316 to the edge facet 320 of thechip 308 and bringing the v-groove assembly 108 near the edge facet 320so that adhesive 316 touches the bonding facet 208.

In step 1112, the v-groove assembly 108 is aligned with the chip 308.For example, the optical fiber 104, bonded to the v-groove assembly 108,is aligned with the waveguide 312 of the chip 308. In some embodiments,the gripper 404 is used to align the v-groove assembly 108 with the chip308 (e.g., by holding the lid 120 of the v-groove assembly 108). In someembodiments, light from the optical fiber 104, which is coupled into thewaveguide 312, is used in aligning the v-groove assembly 108 with thechip 308. For example, the waveguide 312 couples light from the opticalfiber 104 to a photodetector (either on the chip 308, such as a PINdiode formed in the device layer of the SOI wafer, or off the chip 308).Feedback from the photodetector is used to align the optical fiber 104to the waveguide 312.

In step 1116, the adhesive 316 is cured. In some embodiments, theadhesive 316 is an epoxy resin and is cured with UV light (e.g., similarto lamp 620 producing light of a second wavelength). In someembodiments, light of the second wavelength is transmitted through thev-groove assembly 108 (e.g., and through the bonding facet 208). Lightof the second wavelength is transmitted through the v-groove assembly108 because the v-groove assembly 108 is made of fused silica, which istransparent to UV light. In some embodiments, a second cure is performedafter a first cure (e.g., see discussion relating to FIG. 3). In someembodiments, transmitting light of the second wavelength through thev-groove assembly 108 is done so that the gripper 404 can hold thev-groove assembly 108 in place after alignment and during cure so thatthe optical fiber 104 remains aligned with the waveguide 312. In someembodiments, the term “v-groove” is used as a generic term for a grooveconfigured to position an optical fiber in a material, and may includeshapes such as a ‘v’, a trench (e.g., flat sides), and ‘u’-shapedgrooves, depending on fabrication (e.g., trenches, in some embodiments,are easier to cut or etch in fused silica than a ‘v’; in someembodiments, a v-groove is cut or etched if the base 202 is made ofcrystalline material and etching can be done by etching on a crystallineplane).

The specific details of particular embodiments may be combined in anysuitable manner without departing from the spirit and scope ofembodiments of the invention. However, other embodiments of theinvention may be directed to specific embodiments relating to eachindividual aspect, or specific combinations of these individual aspects.

The above description of exemplary embodiments of the invention has beenpresented for the purposes of illustration and description. It is notintended to be exhaustive or to limit the invention to the precise formdescribed, and many modifications and variations are possible in lightof the teaching above. The embodiments were chosen and described inorder to explain the principles of the invention and its practicalapplications to thereby enable others skilled in the art to utilize theinvention in various embodiments and with various modifications as aresuited to the particular use contemplated.

For example, in some embodiments, the waveguide 312 of the chip 308comprises a taper to more efficiently couple light into the waveguide312. In some embodiments, the waveguide 312 has rectangular crosssection. In some embodiments, the waveguide is a ridge waveguide. Insome embodiments, the mirror 612 comprises multilayers. In someembodiments, the mirror 612 comprises metal. In some embodiments, themirror 612 is a block (e.g., a flat piece of metal).

In some embodiments, a tip 116 other than a lensed fiber is used (e.g.,flat, cleaved end of a fiber). In some embodiments, the optical fiber104 is aligned to a device other than the waveguide 312 of the chip 308.For example, the tip 116 of the optical fiber 104 could be aligned to aphotodiode or a laser in the chip 308. In some embodiments, the lid 120and/or the base 202 of the v-groove assembly are made of other materialtransparent to UV light (e.g., the lid 120 is made of quartz or UV-gradesapphire).

In some embodiments, the chip 308 comprises a light source (e.g., ismade of III-V material as a gain medium for a laser). Light is coupledfrom the chip 308 to the optical fiber 104.

Also, it is noted that the embodiments may be described as a processwhich is depicted as a flowchart, a flow diagram, a data flow diagram, astructure diagram, or a block diagram.

Although a flowchart may describe the operations as a sequentialprocess, many of the operations can be performed in parallel orconcurrently. In addition, the order of the operations may bere-arranged. A process is terminated when its operations are completed,but could have additional steps not included in the figure. A processmay correspond to a method, a function, a procedure, a subroutine, asubprogram, etc.

A recitation of “a”, “an”, or “the” is intended to mean “one or more”unless specifically indicated to the contrary.

All patents, patent applications, publications, and descriptionsmentioned here are incorporated by reference in their entirety for allpurposes. None is admitted to be prior art.

1. (canceled)
 2. A method for optically coupling an optical fiber to asemiconductor waveguide, the method comprising: providing an opticalassembly for connecting the optical fiber to the semiconductorwaveguide, the optical assembly comprising: a v-groove assemblycomprising: a base; a lid; a v-groove; and a facet, wherein the facet isfor bonding the v-groove assembly to an optical chip; the optical fiberis positioned in the v-groove between the base and the lid; and epoxybonding the optical fiber to the base and the lid, wherein the epoxy is,at least partially, cured using light; providing the optical chip,wherein the optical chip comprises the semiconductor waveguide; aligningthe v-groove assembly with the optical chip so that the optical fiberaligns with the semiconductor waveguide; applying adhesive between thefacet of the v-groove assembly and the optical chip so that the adhesivecontacts both the facet of the v-groove assembly and the optical chipafter the v-groove assembly is aligned with the optical chip; andirradiating the adhesive to, at least partially, cure the adhesive. 3.The method of claim 2, further comprising: After irradiating theadhesive, applying additional adhesive; curing, at least partially, theadditional adhesive with light; and curing, with heat, the additionaladhesive.
 4. The method of claim 2, further comprising bonding the facetof the v-groove assembly to an edge facet of the optical chip.
 5. Themethod of claim 2, further comprising using a gripper that mechanicallyholds the v-groove assembly to align the v-groove assembly with theoptical chip.
 6. The method of claim 5, wherein the gripper holds thev-groove assembly by the lid during alignment of the v-groove assemblywith the optical chip and during irradiating the adhesive to, at leastpartially, cure the adhesive.
 7. The method of claim 2, furthercomprising using feedback from a diode on the optical chip to align thev-groove assembly with the optical chip, wherein the diode detects lightcoupled from the optical fiber into the semiconductor waveguide.
 8. Themethod of claim 2, further comprising using ultraviolet light to, atleast partially, cure the adhesive.
 9. The method of claim 2, furthercomprising transmitting light through the v-groove assembly to irradiatethe adhesive.
 10. The method of claim 2, wherein a thickness of theadhesive between the facet of the v-groove assembly and the opticalchip, after aligning the v-groove assembly with the optical chip andbefore irradiating the adhesive, is from seven to ten microns.
 11. Asystem for coupling light from a chip to an optical network, the systemcomprising: a v-groove assembly comprising: a base; a lid; a v-groove;and a facet; an optical fiber bonded in the v-groove assembly betweenthe base and the lid, wherein the optical fiber is bonded in thev-groove by an epoxy cured by ultraviolet light; and the chip having awaveguide, wherein the chip is bonded to the facet of the v-grooveassembly by an adhesive so that an end of the optical fiber aligns withthe waveguide of the chip.
 12. The system of claim 11, wherein: the chipcomprises a substrate, an insulating layer, and a device layer; thewaveguide of the chip is formed in the device layer; and the devicelayer is crystalline silicon.
 13. The system of claim 11, wherein theadhesive is an epoxy resin.
 14. The system of claim 11, wherein thev-groove assembly is bonded to an edge facet of the chip.
 15. The systemof claim 11, wherein the v-groove assembly is made of fused silica. 16.A method for optically coupling an optical fiber to a semiconductorwaveguide, the method comprising: providing an optical assembly forconnecting the optical fiber to the semiconductor waveguide, the opticalassembly comprising: a v-groove assembly comprising: a base; a lid; av-groove; and a facet, wherein the facet is for bonding the v-grooveassembly to an optical chip; the optical fiber is positioned in thev-groove between the base and the lid; and epoxy bonding the opticalfiber to the base and the lid, wherein the epoxy is, at least partially,cured using light; providing the optical chip, wherein the optical chipcomprises the semiconductor waveguide; aligning the v-groove assemblywith the optical chip so that the optical fiber aligns with thesemiconductor waveguide; applying adhesive between the facet of thev-groove assembly and the optical chip so that the adhesive contactsboth the facet of the v-groove assembly and the optical chip after thev-groove assembly is aligned with the optical chip; irradiating theadhesive to, at least partially, cure the adhesive; applying additionaladhesive; and curing, at least partially, the additional adhesive. 17.The method of claim 16, wherein curing the additional adhesive comprisescuring with light and heat.
 18. The method of claim 16, wherein aligningthe v-groove assembly with the optical chip places the facet of thev-groove assembly no more than ten microns away from the optical chip.19. The method of claim 16, wherein the v-groove assembly is made offused silica and the semiconductor waveguide is made of crystallinesilicon.
 20. The method of claim 16, further comprising using a diode onthe optical chip to align the v-groove assembly with the optical chip.21. The method of claim 16, wherein the adhesive contacts an edge facetof the optical chip.